LGA 1700

Since the introduction of Land grid array based sockets in the consumer hardware space in 2004,[3] the thermal solution hole pattern (the distance between the screw-holes for the heatsink) has changed three times for Intel's mainstream platforms:

• For LGA 775 it is 72 mm × 72 mm
• For LGA 1156, LGA 1155, LGA 1150, LGA 1151 and LGA 1200 it is 75 mm × 75 mm
• For LGA 1700 it is 78 mm × 78 mm

While some motherboards do offer additional mounting holes for using older coolers, e.g. for using an LGA115x cooler on an LGA1700 motherboard, differences in Z-height and the mounting pressure will result in worse than expected cooling performance. For best results it is recommended to either change the cooling solution to a model certified for this platform or request an updated mounting-kit[4][5][6] for one of the higher-end solutions on the market. For heat-sinks to be interchangeable not only the hole pattern, but also the socket seating plane height, the maximum thermal solution center of gravity height from the IHS or the static total compressive minimum need to match.

Even though some CPU cooler manufacturers are providing adapter kits (usually in the form of different screws) to go with existing LGA115x retention brackets, there have been reports of the CPU bending or bowing which leads to a reduced contact patch with the cooler plate, which then leads to increased temperatures[7]

• List of Intel microprocessors
• List of Intel chipsets