Advanced packaging (semiconductors)

Advanced packaging[1] is the aggregation and interconnection of components before traditional electronic packaging. Advanced packaging allows multiple devices (electrical, mechanical, or semiconductor) to be merged and packaged as a single electronic device. Unlike traditional electronic packaging, advanced packaging employs processes and techniques that are performed at semiconductor fabrication facilities. Advanced packaging thus sits between fabrication and traditional packaging -- or, in other terminology, between BEoL and post-fab. Advanced packaging includes multi-chip modules, 3D ICs, 2.5D ICs, heterogeneous integration, fan-out wafer-level packaging, system-in-package, quilt packaging, etc.